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Design-for-test and test optimizatio...
~
Noia, Brandon.
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Design-for-test and test optimization techniques for TSV-based 3D stacked ICs
Record Type:
Electronic resources : Monograph/item
Title/Author:
Design-for-test and test optimization techniques for TSV-based 3D stacked ICs/ by Brandon Noia, Krishnendu Chakrabarty.
Author:
Noia, Brandon.
other author:
Chakrabarty, Krishnendu.
Published:
Cham :Springer International Publishing : : 2014.,
Description:
xviii, 247 p. :ill. (some col.), digital ;24 cm.
Contained By:
Springer eBooks
Subject:
Three-dimensional integrated circuits - Testing. -
Online resource:
http://dx.doi.org/10.1007/978-3-319-02378-6
ISBN:
9783319023786 (electronic bk.)
Design-for-test and test optimization techniques for TSV-based 3D stacked ICs
Noia, Brandon.
Design-for-test and test optimization techniques for TSV-based 3D stacked ICs
[electronic resource] /by Brandon Noia, Krishnendu Chakrabarty. - Cham :Springer International Publishing :2014. - xviii, 247 p. :ill. (some col.), digital ;24 cm.
ISBN: 9783319023786 (electronic bk.)Subjects--Topical Terms:
2056829
Three-dimensional integrated circuits
--Testing.
Dewey Class. No.: 621.3815
Design-for-test and test optimization techniques for TSV-based 3D stacked ICs
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Engineering (Springer-11647)
based on 0 review(s)
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W9241987
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