Language:
English
繁體中文
Help
回圖書館首頁
手機版館藏查詢
Login
Back
Switch To:
Labeled
|
MARC Mode
|
ISBD
Design for the environment in electr...
~
Siddhaye, Sudarshan Vishwas.
Linked to FindBook
Google Book
Amazon
博客來
Design for the environment in electronics manufacturing: Product optimization for waste stream minimization.
Record Type:
Electronic resources : Monograph/item
Title/Author:
Design for the environment in electronics manufacturing: Product optimization for waste stream minimization./
Author:
Siddhaye, Sudarshan Vishwas.
Description:
133 p.
Notes:
Source: Dissertation Abstracts International, Volume: 61-03, Section: B, page: 1602.
Contained By:
Dissertation Abstracts International61-03B.
Subject:
Engineering, Mechanical. -
Online resource:
http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9966573
ISBN:
9780599713437
Design for the environment in electronics manufacturing: Product optimization for waste stream minimization.
Siddhaye, Sudarshan Vishwas.
Design for the environment in electronics manufacturing: Product optimization for waste stream minimization.
- 133 p.
Source: Dissertation Abstracts International, Volume: 61-03, Section: B, page: 1602.
Thesis (Ph.D.)--University of California, Berkeley, 1999.
Environmental awareness is growing rapidly in the manufacturing sector, thanks to the increasingly stringent government regulations on health and safety of the workers, regulations on air, water and land emissions, emerging international standards on environmental performance and a growing consumer preference for 'green' products.
ISBN: 9780599713437Subjects--Topical Terms:
783786
Engineering, Mechanical.
Design for the environment in electronics manufacturing: Product optimization for waste stream minimization.
LDR
:02892nmm 2200301 4500
001
1833402
005
20071004071928.5
008
130610s1999 eng d
020
$a
9780599713437
035
$a
(UMI)AAI9966573
035
$a
AAI9966573
040
$a
UMI
$c
UMI
100
1
$a
Siddhaye, Sudarshan Vishwas.
$3
1922106
245
1 0
$a
Design for the environment in electronics manufacturing: Product optimization for waste stream minimization.
300
$a
133 p.
500
$a
Source: Dissertation Abstracts International, Volume: 61-03, Section: B, page: 1602.
500
$a
Chair: Paul S. Sheng.
502
$a
Thesis (Ph.D.)--University of California, Berkeley, 1999.
520
$a
Environmental awareness is growing rapidly in the manufacturing sector, thanks to the increasingly stringent government regulations on health and safety of the workers, regulations on air, water and land emissions, emerging international standards on environmental performance and a growing consumer preference for 'green' products.
520
$a
This dissertation presents an optimization framework that integrates the manufacturing process models with industrial hygiene models to make design level decisions that minimize the process waste in electronics manufacturing while taking into account various design trade-offs. The salient points presented in this dissertation are: (1) Development of unit process models for printed circuit board fabrication, component assembly and device packaging that relate the manufacturing waste streams on per product basis to various product design and process parameters such as board area, number of layers, thickness of dielectric material, flow rates of solvents etc. (2) Estimation of various design parameters that are not available to the designer at the beginning of the detailed design process. These include required number of signal layers, approximate copper fraction of signal layers and number of boards tiled on a panel. (3) Computation of health hazard scores of various waste streams using the 'Health Hazard Scoring' system and computation of the environmental impact through the index of weighted mass of waste streams. (4) A design optimization algorithm that minimizes the weighted mass of manufacturing waste streams for bare board fabrication and an extension of this algorithm that considers the entire printed circuit assembly manufacturing which includes device manufacturing, board fabrication and component assembly. (5) Development of a sensitivity diagram to assist the printed circuit board assembly designer with ranking the design decisions according to their impact.
590
$a
School code: 0028.
650
4
$a
Engineering, Mechanical.
$3
783786
650
4
$a
Engineering, Packaging.
$3
1025152
650
4
$a
Environmental Sciences.
$3
676987
690
$a
0548
690
$a
0549
690
$a
0768
710
2 0
$a
University of California, Berkeley.
$3
687832
773
0
$t
Dissertation Abstracts International
$g
61-03B.
790
1 0
$a
Sheng, Paul S.,
$e
advisor
790
$a
0028
791
$a
Ph.D.
792
$a
1999
856
4 0
$u
http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9966573
based on 0 review(s)
Location:
ALL
電子資源
Year:
Volume Number:
Items
1 records • Pages 1 •
1
Inventory Number
Location Name
Item Class
Material type
Call number
Usage Class
Loan Status
No. of reservations
Opac note
Attachments
W9224266
電子資源
11.線上閱覽_V
電子書
EB
一般使用(Normal)
On shelf
0
1 records • Pages 1 •
1
Multimedia
Reviews
Add a review
and share your thoughts with other readers
Export
pickup library
Processing
...
Change password
Login