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Improving thermal interface material...

Aoyagi, Yasuhiro.

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Improving thermal interface materials through the liquid component.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Improving thermal interface materials through the liquid component./
Author:	Aoyagi, Yasuhiro.
Description:	92 p.
Notes:	Source: Masters Abstracts International, Volume: 44-05, page: 2426.
Contained By:	Masters Abstracts International44-05.
Subject:	Chemistry, Polymer. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1434202
ISBN:	9780542628573

Improving thermal interface materials through the liquid component.
Aoyagi, Yasuhiro.

Improving thermal interface materials through the liquid component. - 92 p.

Source: Masters Abstracts International, Volume: 44-05, page: 2426.

Thesis (M.S.)--State University of New York at Buffalo, 2006.

Thermal interface materials for thermal conduction of excess heat from microelectronics have been developed and evaluated. The optimum carbon black content of the thixotropic paste based on polyol ethers is 2.40 vol.%. The resulting thermal contact conductance is 30 x 104 W/m 2.°C for mating surface roughnesses of 0.05 mm. Carbon black pastes are also effective as coatings for improving the performance of thermal gap-filling materials. Polyol-based phase-change materials, including a diol with 4 vol.% boron nitride, exhibit higher thermal contact conductance and higher thermal stability than conventional phase change materials. Moreover, a high thermal stability has been attained by using polyol esters with a half-hindered phenolic primary antioxidant and a thiopropionate secondary antioxidant, along with either carbon black or boron nitride particles. Both solid components serve as antioxidants in the presence of either primary antioxidant or secondary antioxidant, but they hinder the synergistic effect between primary and secondary antioxidants.

ISBN: 9780542628573Subjects--Topical Terms:

1018428
Chemistry, Polymer.

Improving thermal interface materials through the liquid component.
LDR:01966nmm 2200289 4500 001 1830801
005 20070427114547.5
008 130610s2006 eng d
020 $a 9780542628573
035 $a (UnM)AAI1434202
035 $a AAI1434202
040 $a UnM $c UnM
100 1 $a Aoyagi, Yasuhiro. $3 1919619
245 1 0 $a Improving thermal interface materials through the liquid component.
300 $a 92 p.
500 $a Source: Masters Abstracts International, Volume: 44-05, page: 2426.
500 $a Adviser: Deborah D. L. Chung.
502 $a Thesis (M.S.)--State University of New York at Buffalo, 2006.
520 $a Thermal interface materials for thermal conduction of excess heat from microelectronics have been developed and evaluated. The optimum carbon black content of the thixotropic paste based on polyol ethers is 2.40 vol.%. The resulting thermal contact conductance is 30 x 104 W/m 2.°C for mating surface roughnesses of 0.05 mm. Carbon black pastes are also effective as coatings for improving the performance of thermal gap-filling materials. Polyol-based phase-change materials, including a diol with 4 vol.% boron nitride, exhibit higher thermal contact conductance and higher thermal stability than conventional phase change materials. Moreover, a high thermal stability has been attained by using polyol esters with a half-hindered phenolic primary antioxidant and a thiopropionate secondary antioxidant, along with either carbon black or boron nitride particles. Both solid components serve as antioxidants in the presence of either primary antioxidant or secondary antioxidant, but they hinder the synergistic effect between primary and secondary antioxidants.
590 $a School code: 0656.
650 4 $a Chemistry, Polymer. $3 1018428
650 4 $a Engineering, Mechanical. $3 783786
650 4 $a Engineering, Materials Science. $3 1017759
690 $a 0495
690 $a 0548
690 $a 0794
710 2 0 $a State University of New York at Buffalo. $3 1017814
773 0 $t Masters Abstracts International $g 44-05.
790 1 0 $a Chung, Deborah D. L., $e advisor
790 $a 0656
791 $a M.S.
792 $a 2006
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1434202