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Novel additives for conductive epoxy...

Hanchinamani, Virupaxappa C.

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Novel additives for conductive epoxy adhesive.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Novel additives for conductive epoxy adhesive./
Author:	Hanchinamani, Virupaxappa C.
Description:	81 p.
Notes:	Source: Masters Abstracts International, Volume: 40-01, page: 0179.
Contained By:	Masters Abstracts International40-01.
Subject:	Chemistry, Polymer. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=1405275
ISBN:	9780493296166

Novel additives for conductive epoxy adhesive.
Hanchinamani, Virupaxappa C.

Novel additives for conductive epoxy adhesive. - 81 p.

Source: Masters Abstracts International, Volume: 40-01, page: 0179.

Thesis (M.S.Eng.)--University of Massachusetts Lowell, 2001.

Conductive adhesive technology has attracted more and more attention of the electronics industry. The new technology offers numerous advantages over traditional soldering technology. However, some critical limitations of this technology have slowed its potentially wide applications in the electronics industry. These limitations include lower electrical conductivity, increased contact resistance during elevated temperature and humidity aging, and poor impact performance. Fortunately conductive adhesive technology has advanced significantly. The purpose of this thesis was to explore the effects of novel additives on the electrical conductivity and their effect on the contact resistance during humidity aging (85°C/85RH). The additives used in the present study included various conductive additives and corrosion inhibitors. The effect of these additives was analyzed using an in-house conductive epoxy formulation. It was observed that the addition of 1.8% by volume of 2-Hydroxyquinoline, 6-Hydroxyquinoline and combination of 8-Hydroxyquinoline & N-Hydroxysuccinimide gave stable contact resistance during 85°C/85RH aging. Replacing part of the silver with other conductive additives resulted in lower electrical conductivity.

ISBN: 9780493296166Subjects--Topical Terms:

1018428
Chemistry, Polymer.

Novel additives for conductive epoxy adhesive.
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245 1 0 $a Novel additives for conductive epoxy adhesive.
300 $a 81 p.
500 $a Source: Masters Abstracts International, Volume: 40-01, page: 0179.
500 $a Adviser: Stephen Burke Driscoll.
502 $a Thesis (M.S.Eng.)--University of Massachusetts Lowell, 2001.
520 $a Conductive adhesive technology has attracted more and more attention of the electronics industry. The new technology offers numerous advantages over traditional soldering technology. However, some critical limitations of this technology have slowed its potentially wide applications in the electronics industry. These limitations include lower electrical conductivity, increased contact resistance during elevated temperature and humidity aging, and poor impact performance. Fortunately conductive adhesive technology has advanced significantly. The purpose of this thesis was to explore the effects of novel additives on the electrical conductivity and their effect on the contact resistance during humidity aging (85°C/85RH). The additives used in the present study included various conductive additives and corrosion inhibitors. The effect of these additives was analyzed using an in-house conductive epoxy formulation. It was observed that the addition of 1.8% by volume of 2-Hydroxyquinoline, 6-Hydroxyquinoline and combination of 8-Hydroxyquinoline & N-Hydroxysuccinimide gave stable contact resistance during 85°C/85RH aging. Replacing part of the silver with other conductive additives resulted in lower electrical conductivity.
590 $a School code: 0111.
650 4 $a Chemistry, Polymer. $3 1018428
650 4 $a Engineering, Chemical. $3 1018531
650 4 $a Engineering, Materials Science. $3 1017759
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773 0 $t Masters Abstracts International $g 40-01.
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