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Electronically conductive adhesives:...

Wei, Yong.

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Electronically conductive adhesives: Conduction mechanisms, mechanical behavior and durability.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Electronically conductive adhesives: Conduction mechanisms, mechanical behavior and durability./
Author:	Wei, Yong.
Description:	137 p.
Notes:	Source: Dissertation Abstracts International, Volume: 56-04, Section: B, page: 2290.
Contained By:	Dissertation Abstracts International56-04B.
Subject:	Engineering, Chemical. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9527571

Electronically conductive adhesives: Conduction mechanisms, mechanical behavior and durability.
Wei, Yong.

Electronically conductive adhesives: Conduction mechanisms, mechanical behavior and durability. - 137 p.

Source: Dissertation Abstracts International, Volume: 56-04, Section: B, page: 2290.

Thesis (Ph.D.)--Clarkson University, 1995.

The objective of this research is to provide a fundamental understanding of the conduction mechanisms for electrically conductive adhesives and their applications. This research involves two parts: (a) analysis on mechanical behavior and, (b) analysis on electrical behavior of conductive adhesives. Electrical and mechanical behaviors of both bulk conductive adhesives and single lap joints bonded with a conductive adhesive are studied.Subjects--Topical Terms:

1018531
Engineering, Chemical.

Electronically conductive adhesives: Conduction mechanisms, mechanical behavior and durability.
LDR:03114nmm 2200313 4500 001 1828438
005 20071030074143.5
008 130610s1995 eng d
035 $a (UMI)AAI9527571
035 $a AAI9527571
040 $a UMI $c UMI
100 1 $a Wei, Yong. $3 1917337
245 1 0 $a Electronically conductive adhesives: Conduction mechanisms, mechanical behavior and durability.
300 $a 137 p.
500 $a Source: Dissertation Abstracts International, Volume: 56-04, Section: B, page: 2290.
500 $a Adviser: Erol Sancaktar.
502 $a Thesis (Ph.D.)--Clarkson University, 1995.
520 $a The objective of this research is to provide a fundamental understanding of the conduction mechanisms for electrically conductive adhesives and their applications. This research involves two parts: (a) analysis on mechanical behavior and, (b) analysis on electrical behavior of conductive adhesives. Electrical and mechanical behaviors of both bulk conductive adhesives and single lap joints bonded with a conductive adhesive are studied.
520 $a For bulk conductive adhesives, a comparative model was established to predict the conductivity of homogeneous metal particles. Based on this model, experiments were performed to evaluate the contact resistance of particles. Using this model we are also able to study the contact behavior of particle chains in adhesives as predicted by percolation theory. The effect of film thickness on the conduction behavior of conductive adhesives is also presented. To consider mechanical behavior of bulk adhesives, Chow's method was modified to predict the mechanical constants (Young's, shear and bulk moduli). Silver migration problem in silver loaded adhesives was studied analytically and experimentally.
520 $a Using CDA 151 copper substrates with four different platings, we performed joint durability experiments under environmental attack (humidity and thermal cycling) for conductive adhesive joints. Substrate/adhesive interfacial failure mode was observed in all experiments as expected based on the analysis of the substrate surface topographical and chemical composition. The analyses on the plating surfaces by SEM and Auger reveal that the topographical and chemical composition of substrates will significantly affect the joint behavior both electrically and mechanically. In order to evaluate the thermal mismatch stress induced at the interface between adhesive and substrate, a finite element analysis model was developed and calculated by ANSYS. The results both from finite element method and theoretical analysis are closely fitted.
520 $a A computer simulation of the current paths for adhesive randomly loaded with metal fillers is developed to bridge the local contact mode to the global conduction behavior of conductive adhesives.
590 $a School code: 0049.
650 4 $a Engineering, Chemical. $3 1018531
650 4 $a Engineering, Electronics and Electrical. $3 626636
650 4 $a Engineering, Mechanical. $3 783786
690 $a 0542
690 $a 0544
690 $a 0548
710 2 0 $a Clarkson University. $3 1020943
773 0 $t Dissertation Abstracts International $g 56-04B.
790 1 0 $a Sancaktar, Erol, $e advisor
790 $a 0049
791 $a Ph.D.
792 $a 1995
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=9527571