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Stress induced delamination methods ...

Lee, Alan.

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Stress induced delamination methods for the study of platinum adhesion.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Stress induced delamination methods for the study of platinum adhesion./
Author:	Lee, Alan.
Description:	235 p.
Notes:	Source: Dissertation Abstracts International, Volume: 65-11, Section: B, page: 5981.
Contained By:	Dissertation Abstracts International65-11B.
Subject:	Engineering, Materials Science. -
Online resource:	http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3153111
ISBN:	9780496135561

Stress induced delamination methods for the study of platinum adhesion.
Lee, Alan.

Stress induced delamination methods for the study of platinum adhesion. - 235 p.

Source: Dissertation Abstracts International, Volume: 65-11, Section: B, page: 5981.

Thesis (Ph.D.)--Stanford University, 2005.

Adhesion of Pt films to Si substrates with a native oxide has been investigated using two novel methods of quantitative adhesion characterization. The nanoindentation induced delamination method uses an impression to store compressive strain in an overlayer film to induce delamination at the Pt/SiO2 interface. Likewise, the telephone cord delamination method involves sputtering a thick compressively stressed overlayer onto the Pt/SiO2 films to induce telephone cord delamination patterns in the film. Crack energy release rates and interface toughnesses are calculated from the dimensions of the circular blisters or the telephone cords using currently available models. Focused ion beam (FIB) observations show that the nanoindentation method is difficult to implement because of extensive crack formation in the substrate beneath the indentation, causing interface toughnesses from this test to be gross overestimates. The telephone cord measurements, by comparison, give realistic interface toughnesses, allowing us to show that decreasing the argon pressure during Pt sputtering significantly increases the adhesion of the films to the substrate. Four-point bending experiments on the same interfaces were also conducted in order to compare the results with those of the telephone cord induced delamination method. The mechanism for the increased toughnesses of the interfaces as the argon sputtering pressure during Pt deposition was lowered was investigated as well. Results from XPS analysis shows that a more chemically diffuse interface is responsible.

ISBN: 9780496135561Subjects--Topical Terms:

1017759
Engineering, Materials Science.

Stress induced delamination methods for the study of platinum adhesion.
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020 $a 9780496135561
035 $a (UnM)AAI3153111
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100 1 $a Lee, Alan. $3 605088
245 1 0 $a Stress induced delamination methods for the study of platinum adhesion.
300 $a 235 p.
500 $a Source: Dissertation Abstracts International, Volume: 65-11, Section: B, page: 5981.
500 $a Adviser: William D. Nix.
502 $a Thesis (Ph.D.)--Stanford University, 2005.
520 $a Adhesion of Pt films to Si substrates with a native oxide has been investigated using two novel methods of quantitative adhesion characterization. The nanoindentation induced delamination method uses an impression to store compressive strain in an overlayer film to induce delamination at the Pt/SiO2 interface. Likewise, the telephone cord delamination method involves sputtering a thick compressively stressed overlayer onto the Pt/SiO2 films to induce telephone cord delamination patterns in the film. Crack energy release rates and interface toughnesses are calculated from the dimensions of the circular blisters or the telephone cords using currently available models. Focused ion beam (FIB) observations show that the nanoindentation method is difficult to implement because of extensive crack formation in the substrate beneath the indentation, causing interface toughnesses from this test to be gross overestimates. The telephone cord measurements, by comparison, give realistic interface toughnesses, allowing us to show that decreasing the argon pressure during Pt sputtering significantly increases the adhesion of the films to the substrate. Four-point bending experiments on the same interfaces were also conducted in order to compare the results with those of the telephone cord induced delamination method. The mechanism for the increased toughnesses of the interfaces as the argon sputtering pressure during Pt deposition was lowered was investigated as well. Results from XPS analysis shows that a more chemically diffuse interface is responsible.
590 $a School code: 0212.
650 4 $a Engineering, Materials Science. $3 1017759
690 $a 0794
710 2 0 $a Stanford University. $3 754827
773 0 $t Dissertation Abstracts International $g 65-11B.
790 1 0 $a Nix, William D., $e advisor
790 $a 0212
791 $a Ph.D.
792 $a 2005
856 4 0 $u http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3153111