Lau, John H.
Overview
| Works: | 1 works in 7 publications in 2 languages | |
|---|---|---|
Titles
Assembly and reliability of lead-free solder joints
by:
Lau, John H.; Lee, Ning-Cheng.; SpringerLink (Online service)
(Electronic resources)
Fan-out wafer-level packaging
by:
Lau, John H.; SpringerLink (Online service)
(Electronic resources)
Microvias = for low cost, high density interconnects /
by:
Lee, S. W. Ricky.; NetLibrary, Inc.; Lau, John H.
(Language materials, printed)
Chiplet design and heterogeneous integration packaging
by:
Lau, John H.; SpringerLink (Online service)
(Electronic resources)
Semiconductor advanced packaging
by:
Lau, John H.; SpringerLink (Online service)
(Electronic resources)
Subjects
Semiconductors.
Solder and soldering.
Joints (Engineering)
Microelectromechanical systems.
Electronics and Microelectronics, Instrumentation.
Semiconductors- Design and construction.
Microsystems and MEMS.
Printed circuits.
Circuits and Systems.
Integrated circuits- Design and construction.
電路
Semiconductors- Junctions.
Chip scale packaging.
Nanotechnology and Microengineering.
Microelectronic packaging.
Engineering.
Optical and Electronic Materials.
Electronic Circuits and Systems.
Integrated circuits- Design and construction
Integrated circuits.
Electronic Circuits and Devices.
Industrial and Production Engineering.