Languages
Gan, Chong Leong.
Overview
| Works: | 1 works in 2 publications in 1 languages | |
|---|---|---|
Titles
Interconnect reliability in advanced memory device packaging
by:
Gan, Chong Leong.; Huang, Chen-Yu.; SpringerLink (Online service)
(Electronic resources)
Electronic materials innovations and reliability in advanced memory packaging
by:
Gan, Chong Leong.; Huang, Chen-Yu.; SpringerLink (Online service)
(Electronic resources)
Subjects
Electronics Design and Verification.
Interconnects (Integrated circuit technology)- Reliability.
Materials Engineering.
Computer storage devices- Packaging.
Electronic Circuits and Systems.
Hardware Performance and Reliability.
Electronic packaging- Materials.
Electronic Materials.
Industrial and Production Engineering.