Languages
Lu, Daniel.
Overview
| Works: | 1 works in 1 publications in 1 languages | |
|---|---|---|
Titles
Electrical conductive adhesives with nanotechnologies
by:
Lu, Daniel.; Wong, C. P.; SpringerLink (Online service); Li, Yi.
(Language materials, printed)
Materials for advanced packaging
by:
Lu, Daniel.; Wong, C.P.; SpringerLink (Online service)
(Electronic resources)
Materials for advanced packaging
by:
Lu, Daniel.; Wong, C.P.; SpringerLink (Online service)
(Language materials, printed)
Subjects
Nanostructured materials.
Packaging- Materials.
Nanotechnology.
Adhesives- Electric properties.
Solder and soldering.
Material Science.
Electronics and Microelectronics, Instrumentation.
Circuits and Systems.
Materials Science, general.
Metallic Materials.
Electronic packaging.
Nanotechnology and Microengineering.
Microelectronic packaging.
Optical and Electronic Materials.
Engineering.