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Photofunctional layered materials

Yan, Dongpeng.

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Photofunctional layered materials

Record Type:	Electronic resources : Monograph/item
Title/Author:	Photofunctional layered materials/ edited by Dongpeng Yan, Min Wei.
other author:	Yan, Dongpeng.
Published:	Cham :Springer International Publishing : : 2015.,
Description:	vii, 242 p. :ill., digital ;24 cm.
Contained By:	Springer eBooks
Subject:	Layer structure (Solids) -
Online resource:	http://dx.doi.org/10.1007/978-3-319-16991-0
ISBN:	9783319169910 (electronic bk.)

Photofunctional layered materials
Photofunctional layered materials[electronic resource] /edited by Dongpeng Yan, Min Wei. - Cham :Springer International Publishing :2015. - vii, 242 p. :ill., digital ;24 cm. - Structure and bonding,1660081-5993 ;. - Structure and bonding ;26.

Chemical structure and bonding. The scope of the series spans the entire Periodic Table and addresses structure and bonding issues associated with all of the elements. It also focuses attention on new and developing areas of modern structural and theoretical chemistry such as nanostructures, molecular electronics, designed molecular solids, surfaces, metal clusters and supramolecular structures. Physical and spectroscopic techniques used to determine, examine and model structures fall within the purview of Structure and Bonding to the extent that the focus is on the scientific results obtained and not on specialist information concerning the techniques themselves. Issues associated with the development of bonding models and generalizations that illuminate the reactivity pathways and rates of chemical processes are also relevant. The individual volumes in the series are thematic. The goal of each volume is to give the reader, whether at a university or in industry, a comprehensive overview of an area where new insights are emerging that are of interest to a larger scientific audience. Thus each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years should be presented using selected examples to illustrate the principles discussed. A description of the physical basis of the experimental techniques that have been used to provide the primary data may also be appropriate, if it has not been covered in detail elsewhere. The coverage need not be exhaustive in data, but should rather be conceptual, concentrating on the new principles being developed that will allow the reader, who is not a specialist in the area covered, to understand the data presented. Discussion of possible future research directions in the area is welcomed. Review articles for the individual volumes are invited by the volume editors.

ISBN: 9783319169910 (electronic bk.)

Standard No.: 10.1007/978-3-319-16991-0doiSubjects--Topical Terms:

596740
Layer structure (Solids)

LC Class. No.: QD478

Dewey Class. No.: 541.2

Photofunctional layered materials
LDR:02926nmm a2200313 a 4500 001 2006234
003 DE-He213
005 20151210172840.0
006 m d
007 cr nn 008maaau
008 160114s2015 gw s 0 eng d
020 $a 9783319169910 (electronic bk.)
020 $a 9783319169903 (paper)
024 7 $a 10.1007/978-3-319-16991-0 $2 doi
035 $a 978-3-319-16991-0
040 $a GP $c GP
041 0 $a eng
050 4 $a QD478
072 7 $a TBN $2 bicssc
072 7 $a SCI050000 $2 bisacsh
082 0 4 $a 541.2 $2 23
090 $a QD478 $b .P575 2015
245 0 0 $a Photofunctional layered materials $h [electronic resource] / $c edited by Dongpeng Yan, Min Wei.
260 $a Cham : $b Springer International Publishing : $b Imprint: Springer, $c 2015.
300 $a vii, 242 p. : $b ill., digital ; $c 24 cm.
490 1 $a Structure and bonding, $x 0081-5993 ; $v 166
520 $a Chemical structure and bonding. The scope of the series spans the entire Periodic Table and addresses structure and bonding issues associated with all of the elements. It also focuses attention on new and developing areas of modern structural and theoretical chemistry such as nanostructures, molecular electronics, designed molecular solids, surfaces, metal clusters and supramolecular structures. Physical and spectroscopic techniques used to determine, examine and model structures fall within the purview of Structure and Bonding to the extent that the focus is on the scientific results obtained and not on specialist information concerning the techniques themselves. Issues associated with the development of bonding models and generalizations that illuminate the reactivity pathways and rates of chemical processes are also relevant. The individual volumes in the series are thematic. The goal of each volume is to give the reader, whether at a university or in industry, a comprehensive overview of an area where new insights are emerging that are of interest to a larger scientific audience. Thus each review within the volume critically surveys one aspect of that topic and places it within the context of the volume as a whole. The most significant developments of the last 5 to 10 years should be presented using selected examples to illustrate the principles discussed. A description of the physical basis of the experimental techniques that have been used to provide the primary data may also be appropriate, if it has not been covered in detail elsewhere. The coverage need not be exhaustive in data, but should rather be conceptual, concentrating on the new principles being developed that will allow the reader, who is not a specialist in the area covered, to understand the data presented. Discussion of possible future research directions in the area is welcomed. Review articles for the individual volumes are invited by the volume editors.
650 0 $a Layer structure (Solids) $3 596740
650 0 $a Photochemistry. $3 592690
650 0 $a Nanochemistry. $3 813421
650 1 4 $a Chemistry. $3 516420
650 2 4 $a Surfaces and Interfaces, Thin Films. $3 892408
650 2 4 $a Catalysis. $3 560465
700 1 $a Yan, Dongpeng. $3 2153079
700 1 $a Wei, Min. $3 1939315
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
830 0 $a Structure and bonding ; $v 26 $3 1529966
856 4 0 $u http://dx.doi.org/10.1007/978-3-319-16991-0
950 $a Chemistry and Materials Science (Springer-11644)