東華大學圖書館 |

Language: English

回圖書館首頁

手機版館藏查詢

Login

Back

Switch To: Labeled | MARC Mode | ISBD

Advanced materials for thermal manag...

~

Tong, Xingcun Colin.{me_controlnum}

Linked to FindBook

Google Book

Amazon

博客來

Advanced materials for thermal management of electronic packaging

Record Type:	Electronic resources : Monograph/item
Title/Author:	Advanced materials for thermal management of electronic packaging/ by Xingcun Colin Tong.
Author:	Tong, Xingcun Colin.{me_controlnum}
Published:	New York, NY :Springer Springer Science+Business Media, LLC, : 2011.,
Description:	xxi, 606 p. :ill. (some col.), digital ;24 cm.
Series:	Springer series in advanced microelectronics,
Contained By:	Springer eBooks
Subject:	Electronic packaging. -
Online resource:	http://dx.doi.org/10.1007/978-1-4419-7759-5
ISBN:	9781441977595 (electronic bk.)

Advanced materials for thermal management of electronic packaging
Tong, Xingcun Colin.{me_controlnum}

Advanced materials for thermal management of electronic packaging[electronic resource] /by Xingcun Colin Tong. - New York, NY :Springer Springer Science+Business Media, LLC,2011. - xxi, 606 p. :ill. (some col.), digital ;24 cm. - Springer series in advanced microelectronics,301437-0387 ;.

ISBN: 9781441977595 (electronic bk.)Subjects--Topical Terms:

649666
Electronic packaging.

LC Class. No.: TK7870.15 / .T66 2011

Dewey Class. No.: 621.381046

Advanced materials for thermal management of electronic packaging
LDR:00864nmm 2200241 a 4500 001 1265255
003 Springer
005 20110713161834.0
006 m d
007 cr nn 008maaau
008 120817s2011 nyu s j eng d
020 $a 9781441977595 (electronic bk.)
020 $a 9781441977588 (paper)
035 $a 978-1-4419-7758-8
050 0 4 $a TK7870.15 $b .T66 2011
082 0 4 $a 621.381046 $2 22
090 $a TK7870.15 $b .T665 2011
100 1 $a Tong, Xingcun Colin.{me_controlnum} $3 1532274
245 1 0 $a Advanced materials for thermal management of electronic packaging $h [electronic resource] / $c by Xingcun Colin Tong.
260 $a New York, NY : $b Springer Springer Science+Business Media, LLC, $c 2011.
300 $a xxi, 606 p. : $b ill. (some col.), digital ; $c 24 cm.
440 0 $a Springer series in advanced microelectronics, $x 1437-0387 ; $v 30
650 0 $a Electronic packaging. $3 649666
650 0 $a Materials. $3 556501
650 1 4 $a Physics. $3 516296
650 2 4 $a Electronic Circuits and Devices. $3 1245773
650 2 4 $a Optical and Electronic Materials. $3 891120
650 2 4 $a Engineering Thermodynamics, Heat and Mass Transfer. $3 1002079
650 2 4 $a Electronics and Microelectronics, Instrumentation. $3 893838
710 2 $a SpringerLink (Online service) $3 836513
773 0 $t Springer eBooks
856 4 0 $u http://dx.doi.org/10.1007/978-1-4419-7759-5
950 $a Engineering (Springer-11647)

based on 0 review(s)

Location: Year: Volume Number:

Items

1 records • Pages 1 •
1

Inventory Number

No. of reservations

W9137005

電子資源

11.線上閱覽_V

電子書

EB TK7870.15 .T66 2011

一般使用(Normal)

On shelf

0

1 records • Pages 1 •
1

Multimedia

Reviews

Add a review and share your thoughts with other readers

Export

pickup library

Change password

Login