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Study of micron/sub-micron particle ...
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University of Illinois at Chicago.
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Study of micron/sub-micron particle coating in low-pressure plasmas via numerical simulations.
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Study of micron/sub-micron particle coating in low-pressure plasmas via numerical simulations./
作者:
Rovagnati, Beniamino.
面頁冊數:
170 p.
附註:
Adviser: Farzad Mashayek.
Contained By:
Dissertation Abstracts International69-09B.
標題:
Physics, Fluid and Plasma. -
電子資源:
http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3327435
ISBN:
9780549797838
Study of micron/sub-micron particle coating in low-pressure plasmas via numerical simulations.
Rovagnati, Beniamino.
Study of micron/sub-micron particle coating in low-pressure plasmas via numerical simulations.
- 170 p.
Adviser: Farzad Mashayek.
Thesis (Ph.D.)--University of Illinois at Chicago, 2008.
Plasma enhanced chemical vapor deposition (PECVD) process is frequently employed as a means for coating surfaces. Low-pressure and low-temperature plasma is the suitable environment for efficiently generating highly reactive species which are easily chemisorbed onto material surfaces. With this process, the external properties of material surfaces can be properly modified. However, although plasma techniques have extensively been used for film deposition on flat surfaces, deposition on particles has not been systematically attempted due to the difficulty of coating the particles in a uniform manner.
ISBN: 9780549797838Subjects--Topical Terms:
1018402
Physics, Fluid and Plasma.
Study of micron/sub-micron particle coating in low-pressure plasmas via numerical simulations.
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Thesis (Ph.D.)--University of Illinois at Chicago, 2008.
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Plasma enhanced chemical vapor deposition (PECVD) process is frequently employed as a means for coating surfaces. Low-pressure and low-temperature plasma is the suitable environment for efficiently generating highly reactive species which are easily chemisorbed onto material surfaces. With this process, the external properties of material surfaces can be properly modified. However, although plasma techniques have extensively been used for film deposition on flat surfaces, deposition on particles has not been systematically attempted due to the difficulty of coating the particles in a uniform manner.
520
$a
In this thesis, the most important physical phenomena which occur during micron/sub-micron particle plasma deposition in PECVD reactors (i.e., coating and charging) are addressed via numerical simulations. Depending on the characteristic length and time scales of the specific process under analysis, different numerical approaches are implemented. To simulate the coating film growth on a single dust particle where fast chemical reactions take place, a hybrid continuum-kinetic model is developed. Charged and neutral species distributions are calculated, and the growth rate of the amorphous carbon layer at the particle surface, as well as particle charging, are predicted.
520
$a
To broaden the understanding of the particle charging phenomenon, the fully kinetic particle-in-cell method along with Monte Carlo Collisional algorithm is used. Various plasma conditions, such as isotropic or drifting plasmas, collisionless or collisional regimes, are analyzed. When considering a collisionless plasma with flowing ions, an oscillatory behavior in time of the ion wake is observed.
520
$a
Finally, a kinetic model is developed to simulate the evolution of the deposited film morphology on both flat and circular substrates. A combination of Monte Carlo, molecular dynamics techniques and simplifying assumptions is used. The major features of the deposition phenomenon are properly captured as compared to experimental works.
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http://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=3327435
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