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Study of Electrical Contacts to Enca...
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Wang, Zhiying,
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Study of Electrical Contacts to Encapsulated Ultra-Clean Semiconductor Monolayers /
紀錄類型:
書目-電子資源 : Monograph/item
正題名/作者:
Study of Electrical Contacts to Encapsulated Ultra-Clean Semiconductor Monolayers // Zhiying Wang.
作者:
Wang, Zhiying,
面頁冊數:
1 electronic resource (109 pages)
附註:
Source: Dissertations Abstracts International, Volume: 86-08, Section: B.
Contained By:
Dissertations Abstracts International86-08B.
標題:
Nanotechnology. -
電子資源:
https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=31840970
ISBN:
9798304969741
Study of Electrical Contacts to Encapsulated Ultra-Clean Semiconductor Monolayers /
Wang, Zhiying,
Study of Electrical Contacts to Encapsulated Ultra-Clean Semiconductor Monolayers /
Zhiying Wang. - 1 electronic resource (109 pages)
Source: Dissertations Abstracts International, Volume: 86-08, Section: B.
Two-dimensional (2D) materials such as transition metal dichalcogenides (TMDs) are of great interest for electronic and optoelectronic applications. However, a major challenge for both fundamental studies and practical applications of TMD-based devices lies in the difficulty of establishing low-resistance, reliable electrical contacts. Conventional direct metal evaporation methods often causes physical damage at the metal-TMD interface due to the high kinetic energy of the metal atoms. This results in the formation of chemical defects at the contact interface, leading to Fermi-level pinning and high contact resistance. While strategies like using low-melting-point metals or transferred metal contacts have shown promise in forming van der Waals contacts and reducing contact resistance, most prior research has focused on TMDs grown by chemical vapor deposition (CVD) method and devices built on silicon dioxide/silicon (SiO2/Si) substrates. In these cases, atomic defects in the TMDs and surface charges from the substrate can significantly degrade device performance.Our lab has addressed these limitations by growing ultra-high-quality TMD crystals using a two-step flux growth method and minimizing extrinsic disorder in the TMD devices through hexagonal boron nitride (hBN) encapsulation. This thesis aims to study the high-performance electrical contacts to ultra-high-purity monolayer TMDs encapsulated within hBN.Chapter 1 introduces the fundamentals of 2D TMDs and the challenges associated with achieving low-resistance contacts. Chapter 2 describes high-quality TMD crystals and hBN encapsulation technique developed to minimize disorder in 2D TMD devices. Chapter 3 examines low-melting-point bismuth (Bi) semimetal contacts to ultra-clean MoSe2 monolayers, demonstrating that Bi forms damage- and strain-free van der Waals contacts to high-purity MoSe2. To characterize these devices, contact-front and contact-end measurements were combined to unambiguously extract key metal-semiconductor junction parameters that could not be accurately determined using the standard transfer length method (TLM). Additionally, pre-etched hBN was employed as a self-aligned mask, which mechanically stabilizes the weakly coupled van der Waals contacts. This technique enables the scaling of contact lengths from the micron scale down to tens of nanometers. In these deeply scaled contacts, both two-probe resistance and end resistance increased with the characteristic length \uD835\uDC3F\uD835\uDC61, confirming the calculated transfer length.Chapter 4 explores a novel in situ via contact technique for air-sensitive monolayer TMDs. This method uses plasma etching and metal deposition to create 'vias' in the hBN with graphene forming an atomically thin etch-stop. The resulting partially fluorinated graphene (PFG) protects the underlying device layer from air-induced degradation and damage during metal deposition. Using the in situ via technique, an ambipolar contact to air-sensitive monolayer 2H-molybdenum ditelluride (MoTe2) was achieved with more than one order of magnitude improvement in on-current density compared to previous literature. The complete encapsulation provides high reproducibility and long-term stability. This contact technique was also extended to other air-sensitive materials as well as air-stable materials, offering highly competitive device performance. In summary, these studies lay a solid foundation for future research on high-quality devices based on TMD monolayers, which are critical for both practical applications and the exploration of their intrinsic properties.
English
ISBN: 9798304969741Subjects--Topical Terms:
526235
Nanotechnology.
Subjects--Index Terms:
Transfer length method
Study of Electrical Contacts to Encapsulated Ultra-Clean Semiconductor Monolayers /
LDR
:05120nmm a22004453i 4500
001
2433781
005
20250905091012.5
006
m o d
007
cr|nu||||||||
008
261011s2025 miu||||||m |||||||eng d
020
$a
9798304969741
035
$a
(MiAaPQD)AAI31840970
035
$a
AAI31840970
040
$a
MiAaPQD
$b
eng
$c
MiAaPQD
$e
rda
100
1
$a
Wang, Zhiying,
$e
author.
$3
3823528
245
1 0
$a
Study of Electrical Contacts to Encapsulated Ultra-Clean Semiconductor Monolayers /
$c
Zhiying Wang.
264
1
$a
Ann Arbor :
$b
ProQuest Dissertations & Theses,
$c
2025
300
$a
1 electronic resource (109 pages)
336
$a
text
$b
txt
$2
rdacontent
337
$a
computer
$b
c
$2
rdamedia
338
$a
online resource
$b
cr
$2
rdacarrier
500
$a
Source: Dissertations Abstracts International, Volume: 86-08, Section: B.
500
$a
Advisors: Hone, James Committee members: Schuck, James; Kysar, Jeffrey; Eisner, Savannah; Pasupathy, Abhay.
502
$b
Ph.D.
$c
Columbia University
$d
2025.
520
$a
Two-dimensional (2D) materials such as transition metal dichalcogenides (TMDs) are of great interest for electronic and optoelectronic applications. However, a major challenge for both fundamental studies and practical applications of TMD-based devices lies in the difficulty of establishing low-resistance, reliable electrical contacts. Conventional direct metal evaporation methods often causes physical damage at the metal-TMD interface due to the high kinetic energy of the metal atoms. This results in the formation of chemical defects at the contact interface, leading to Fermi-level pinning and high contact resistance. While strategies like using low-melting-point metals or transferred metal contacts have shown promise in forming van der Waals contacts and reducing contact resistance, most prior research has focused on TMDs grown by chemical vapor deposition (CVD) method and devices built on silicon dioxide/silicon (SiO2/Si) substrates. In these cases, atomic defects in the TMDs and surface charges from the substrate can significantly degrade device performance.Our lab has addressed these limitations by growing ultra-high-quality TMD crystals using a two-step flux growth method and minimizing extrinsic disorder in the TMD devices through hexagonal boron nitride (hBN) encapsulation. This thesis aims to study the high-performance electrical contacts to ultra-high-purity monolayer TMDs encapsulated within hBN.Chapter 1 introduces the fundamentals of 2D TMDs and the challenges associated with achieving low-resistance contacts. Chapter 2 describes high-quality TMD crystals and hBN encapsulation technique developed to minimize disorder in 2D TMD devices. Chapter 3 examines low-melting-point bismuth (Bi) semimetal contacts to ultra-clean MoSe2 monolayers, demonstrating that Bi forms damage- and strain-free van der Waals contacts to high-purity MoSe2. To characterize these devices, contact-front and contact-end measurements were combined to unambiguously extract key metal-semiconductor junction parameters that could not be accurately determined using the standard transfer length method (TLM). Additionally, pre-etched hBN was employed as a self-aligned mask, which mechanically stabilizes the weakly coupled van der Waals contacts. This technique enables the scaling of contact lengths from the micron scale down to tens of nanometers. In these deeply scaled contacts, both two-probe resistance and end resistance increased with the characteristic length \uD835\uDC3F\uD835\uDC61, confirming the calculated transfer length.Chapter 4 explores a novel in situ via contact technique for air-sensitive monolayer TMDs. This method uses plasma etching and metal deposition to create 'vias' in the hBN with graphene forming an atomically thin etch-stop. The resulting partially fluorinated graphene (PFG) protects the underlying device layer from air-induced degradation and damage during metal deposition. Using the in situ via technique, an ambipolar contact to air-sensitive monolayer 2H-molybdenum ditelluride (MoTe2) was achieved with more than one order of magnitude improvement in on-current density compared to previous literature. The complete encapsulation provides high reproducibility and long-term stability. This contact technique was also extended to other air-sensitive materials as well as air-stable materials, offering highly competitive device performance. In summary, these studies lay a solid foundation for future research on high-quality devices based on TMD monolayers, which are critical for both practical applications and the exploration of their intrinsic properties.
546
$a
English
590
$a
School code: 0054
650
4
$a
Nanotechnology.
$3
526235
650
4
$a
Engineering.
$3
586835
650
4
$a
Materials science.
$3
543314
650
4
$a
Applied physics.
$3
3343996
653
$a
Transfer length method
653
$a
Metal deposition
653
$a
Intrinsic properties
653
$a
Magnitude improvement
653
$a
Optoelectronic applications
690
$a
0652
690
$a
0794
690
$a
0537
690
$a
0215
710
2
$a
Columbia University.
$b
Mechanical Engineering.
$e
degree granting institution.
$3
3815556
720
1
$a
Hone, James
$e
degree supervisor.
773
0
$t
Dissertations Abstracts International
$g
86-08B.
790
$a
0054
791
$a
Ph.D.
792
$a
2025
856
4 0
$u
https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=31840970
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