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Electronics and Photonics Packaging ...

Hutchins, Aaron T.,

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Electronics and Photonics Packaging Solutions for Emerging Applications /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	Electronics and Photonics Packaging Solutions for Emerging Applications // Aaron T Hutchins.
作者:	Hutchins, Aaron T.,
面頁冊數:	1 electronic resource (110 pages)
附註:	Source: Dissertations Abstracts International, Volume: 85-11, Section: B.
Contained By:	Dissertations Abstracts International85-11B.
標題:	Applied physics. -
電子資源:	https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=31141785
ISBN:	9798382735689

Electronics and Photonics Packaging Solutions for Emerging Applications /
Hutchins, Aaron T.,

Electronics and Photonics Packaging Solutions for Emerging Applications /Aaron T Hutchins. - 1 electronic resource (110 pages)

Source: Dissertations Abstracts International, Volume: 85-11, Section: B.

The need for novel electronics and photonics packaging solutions is widening as the application of these technologies expands to new geometries and situations. This multi-monograph dissertation will address two thermodynamic packaging challenges as part of UMass Lowell's Harnessing Emerging Research Opportunities to Empower Soldiers (HEROES) partnership with the US Army and one photonics packaging solution in a collaboration with MIT Lincoln Laboratory. First, a conformal thermoelectric cooler was developed to provide personal active cooling for military and civilian use. Second, an improved electroosmotic pump was designed and integrated with fabric to manage moisture in garments and shelters. Finally, a laser fusion splice process for fiber-to-chip photonics attachment was evaluated and optimized. The results of this research include deliverable products and new packaging processes to help physicists and engineers widen the application of electronic and photonic devices.

English

ISBN: 9798382735689Subjects--Topical Terms:

3343996
Applied physics.
Subjects--Index Terms:

Electroosmotic pump

Electronics and Photonics Packaging Solutions for Emerging Applications /
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546 $a English
590 $a School code: 0111
650 4 $a Applied physics. $3 3343996
650 4 $a Electrical engineering. $3 649834
650 4 $a Packaging. $3 585030
650 4 $a Physics. $3 516296
650 4 $a Optics. $3 517925
653 $a Electroosmotic pump
653 $a Fiber-to-chip
653 $a Packaging solution
653 $a Photonic devices
653 $a Thermoelectric cooler
690 $a 0215
690 $a 0544
690 $a 0549
690 $a 0752
690 $a 0605
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