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A Comprehensive Study of Textile-Int...

Lingampally, Shourya Dhatri,

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A Comprehensive Study of Textile-Integrated Connector and Interconnect Design for Wearable Technologies /

紀錄類型:	書目-電子資源 : Monograph/item
正題名/作者:	A Comprehensive Study of Textile-Integrated Connector and Interconnect Design for Wearable Technologies // Shourya Dhatri Lingampally.
作者:	Lingampally, Shourya Dhatri,
面頁冊數:	1 electronic resource (141 pages)
附註:	Source: Masters Abstracts International, Volume: 85-05.
Contained By:	Masters Abstracts International85-05.
標題:	Clothing. -
電子資源:	https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=30673684
ISBN:	9798380711968

A Comprehensive Study of Textile-Integrated Connector and Interconnect Design for Wearable Technologies /
Lingampally, Shourya Dhatri,

A Comprehensive Study of Textile-Integrated Connector and Interconnect Design for Wearable Technologies /Shourya Dhatri Lingampally. - 1 electronic resource (141 pages)

Source: Masters Abstracts International, Volume: 85-05.

Textiles are a great platform for multifunctional wearable electronics given that they are worn and utilized to cover numerous surfaces around human bodies. The global wearable devices market is expected to reach USD 85.6 billion by 2027, driving the demand for interconnects with high reliability and durability. Despite the growing interest and expansion of electronic textiles in Wearables, the development of wearable connectors face significant challenges. The purpose of this research is to study the electrical and mechanical durability of wearable connectors with different interconnect technologies varying the mating/unmating direction and force. The goal is to design and develop state-of-the-art wearable connectors mimicking a snap and a buckle using conductive thread, conductive epoxy, and solder as the interconnect methods. The electrical performance and durability of the connectors were also evaluated for three different mating/unmating forces. The resulting prototypes were subjected to pulling and mating/unmating stresses and tested using standard I2C evaluation protocols enabling a wide range of applications.In terms of electrical performance, it was concluded that the conductive epoxy performed consistently better over repeated mating/unmating compared to conductive thread and solder. The results also showed that connectors with higher mating strength exhibited better electrical performance in terms of lower impedance and resistance. However, as matingunmating repeated, a meaningful trend was not observed. sewn interconnect had the highest mechanical strength, followed by epoxy and solder interconnects. The buckle connectors consistently performed better than the snap connectors electrically and mechanically.

English

ISBN: 9798380711968Subjects--Topical Terms:

3682213
Clothing.

A Comprehensive Study of Textile-Integrated Connector and Interconnect Design for Wearable Technologies /
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520 $a Textiles are a great platform for multifunctional wearable electronics given that they are worn and utilized to cover numerous surfaces around human bodies. The global wearable devices market is expected to reach USD 85.6 billion by 2027, driving the demand for interconnects with high reliability and durability. Despite the growing interest and expansion of electronic textiles in Wearables, the development of wearable connectors face significant challenges. The purpose of this research is to study the electrical and mechanical durability of wearable connectors with different interconnect technologies varying the mating/unmating direction and force. The goal is to design and develop state-of-the-art wearable connectors mimicking a snap and a buckle using conductive thread, conductive epoxy, and solder as the interconnect methods. The electrical performance and durability of the connectors were also evaluated for three different mating/unmating forces. The resulting prototypes were subjected to pulling and mating/unmating stresses and tested using standard I2C evaluation protocols enabling a wide range of applications.In terms of electrical performance, it was concluded that the conductive epoxy performed consistently better over repeated mating/unmating compared to conductive thread and solder. The results also showed that connectors with higher mating strength exhibited better electrical performance in terms of lower impedance and resistance. However, as matingunmating repeated, a meaningful trend was not observed. sewn interconnect had the highest mechanical strength, followed by epoxy and solder interconnects. The buckle connectors consistently performed better than the snap connectors electrically and mechanically.
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