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Test Structures and Economical Non-D...

Wang Lee, Chun-Ting "Tim".

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Test Structures and Economical Non-Destructive Measurement Techniques for Multilayer Printed Circuit Board Impedance Characterization.

Record Type:	Electronic resources : Monograph/item
Title/Author:	Test Structures and Economical Non-Destructive Measurement Techniques for Multilayer Printed Circuit Board Impedance Characterization./
Author:	Wang Lee, Chun-Ting "Tim".
Published:	Ann Arbor : ProQuest Dissertations & Theses, : 2020,
Description:	215 p.
Notes:	Source: Dissertations Abstracts International, Volume: 82-07, Section: B.
Contained By:	Dissertations Abstracts International82-07B.
Subject:	Electrical engineering. -
Online resource:	https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=28156659
ISBN:	9798557023870

Test Structures and Economical Non-Destructive Measurement Techniques for Multilayer Printed Circuit Board Impedance Characterization.
Wang Lee, Chun-Ting "Tim".

Test Structures and Economical Non-Destructive Measurement Techniques for Multilayer Printed Circuit Board Impedance Characterization. - Ann Arbor : ProQuest Dissertations & Theses, 2020 - 215 p.

Source: Dissertations Abstracts International, Volume: 82-07, Section: B.

Thesis (Ph.D.)--University of Colorado at Boulder, 2020.

This item must not be sold to any third party vendors.

Engineers simulate printed circuit board (PCB) designs before manufacturing to ensure performance and to prevent system failures. Nonetheless, variations in the PCB manufacturing process often cause performance discrepancies between the designed circuit board and the fabricated circuit board. By having more information about the as-fabricated circuit board properties, designers can improve the correlation between simulation and measurement and avoid unexpected failures. Printed circuit board manufacturers can monitor the stability of the fabrication process by tracking the as-fabricated printed circuit board properties.To improve the correlation between simulation and measurement of multilayer printed circuit boards (PCBs), this thesis introduces test structures and non-destructive measurement methodologies to extract PCB material properties and the cross-sectional geometry. The test structures and non-destructive measurement techniques presented in this dissertation help engineers predict the as-fabricated impedance within 3% of the measured impedance. Three target as-fabricated parameters were extracted: the as-fabricated trace width, the as-fabricated substrate height, and the as-fabricated bulk dielectric constant. The relationships between the as-fabricated parameters and relevant electrical measurements were identified. Test structures and measurement techniques were developed to extract the as-fabricated parameters. The extraction results were compared to reference measurements to check for consistency. The extracted as-fabricated properties provide better inputs for transmission line modeling, and better metrics for monitoring printed circuit board manufacturing process.

ISBN: 9798557023870Subjects--Topical Terms:

649834
Electrical engineering.
Subjects--Index Terms:

Characterization

Test Structures and Economical Non-Destructive Measurement Techniques for Multilayer Printed Circuit Board Impedance Characterization.
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245 1 0 $a Test Structures and Economical Non-Destructive Measurement Techniques for Multilayer Printed Circuit Board Impedance Characterization.
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300 $a 215 p.
500 $a Source: Dissertations Abstracts International, Volume: 82-07, Section: B.
500 $a Advisor: Piket-May, Melinda J.;Bogatin, Eric.
502 $a Thesis (Ph.D.)--University of Colorado at Boulder, 2020.
506 $a This item must not be sold to any third party vendors.
520 $a Engineers simulate printed circuit board (PCB) designs before manufacturing to ensure performance and to prevent system failures. Nonetheless, variations in the PCB manufacturing process often cause performance discrepancies between the designed circuit board and the fabricated circuit board. By having more information about the as-fabricated circuit board properties, designers can improve the correlation between simulation and measurement and avoid unexpected failures. Printed circuit board manufacturers can monitor the stability of the fabrication process by tracking the as-fabricated printed circuit board properties.To improve the correlation between simulation and measurement of multilayer printed circuit boards (PCBs), this thesis introduces test structures and non-destructive measurement methodologies to extract PCB material properties and the cross-sectional geometry. The test structures and non-destructive measurement techniques presented in this dissertation help engineers predict the as-fabricated impedance within 3% of the measured impedance. Three target as-fabricated parameters were extracted: the as-fabricated trace width, the as-fabricated substrate height, and the as-fabricated bulk dielectric constant. The relationships between the as-fabricated parameters and relevant electrical measurements were identified. Test structures and measurement techniques were developed to extract the as-fabricated parameters. The extraction results were compared to reference measurements to check for consistency. The extracted as-fabricated properties provide better inputs for transmission line modeling, and better metrics for monitoring printed circuit board manufacturing process.
590 $a School code: 0051.
650 4 $a Electrical engineering. $3 649834
650 4 $a Electromagnetics. $3 3173223
650 4 $a Industrial engineering. $3 526216
650 4 $a Design. $3 518875
650 4 $a Materials science. $3 543314
653 $a Characterization
653 $a Fabrication process
653 $a Impedance
653 $a Printed circuit board
653 $a Signal integrity
690 $a 0544
690 $a 0607
690 $a 0389
690 $a 0794
690 $a 0546
710 2 $a University of Colorado at Boulder. $b Electrical Engineering. $3 1025672
773 0 $t Dissertations Abstracts International $g 82-07B.
790 $a 0051
791 $a Ph.D.
792 $a 2020
793 $a English
856 4 0 $u https://pqdd.sinica.edu.tw/twdaoapp/servlet/advanced?query=28156659