東華大學圖書館 |

Language: English

Help

回圖書館首頁

手機版館藏查詢

Back to Search results for [ null ]

Switch To: Labeled | MARC Mode | ISBD

Advances in CMP/polishing technologi...

Doi, Toshiro.

Linked to FindBook

Google Book

Amazon

博客來

Advances in CMP/polishing technologies for the manufacture of electronic devices

Record Type:	Electronic resources : Monograph/item
Title/Author:	Advances in CMP/polishing technologies for the manufacture of electronic devices/ edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.{me_controlnum}
other author:	Doi, Toshiro.
Published:	Oxford :William Andrew, : 2012.,
Description:	1 online resource (xii, 317 p.)
Notes:	Includes index.
Subject:	Electrolytic polishing. -
Online resource:	http://www.sciencedirect.com/science/book/9781437778595
ISBN:	9781437778595

Advances in CMP/polishing technologies for the manufacture of electronic devices
Advances in CMP/polishing technologies for the manufacture of electronic devices[electronic resource] /edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.{me_controlnum} - 1st ed. - Oxford :William Andrew,2012. - 1 online resource (xii, 317 p.)

Includes index.

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.

ISBN: 9781437778595Subjects--Topical Terms:

1613774
Electrolytic polishing.
Index Terms--Genre/Form:

542853
Electronic books.

LC Class. No.: TS670 / .A386 2012eb

Dewey Class. No.: 671.7/2

Advances in CMP/polishing technologies for the manufacture of electronic devices
LDR:01177cmm 2200265Ia 4500 001 1325743
005 20120813074151.0
006 m d
007 cr mn|||||||||
008 130122s2012 enka o 001 0 eng d
020 $a 9781437778595
020 $a 1437778593
029 1 $a AU@ $b 000048545434
035 $a ocn769153733
040 $a HKP $c HKP $d HKP $d OPELS $d TEF $d B24X7
049 $a NTYA
050 4 $a TS670 $b .A386 2012eb
082 0 4 $a 671.7/2 $2 23
245 0 0 $a Advances in CMP/polishing technologies for the manufacture of electronic devices $h [electronic resource] / $c edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa.{me_controlnum}
250 $a 1st ed.
260 $a Oxford : $b William Andrew, $c 2012.
300 $a 1 online resource (xii, 317 p.)
500 $a Includes index.
520 $a CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R&D accessible to the wider engineering community.
650 0 $a Electrolytic polishing. $3 1613774
650 0 $a Grinding and polishing. $3 1005779
655 4 $a Electronic books. $2 lcsh $3 542853
700 1 $a Doi, Toshiro. $4 edt $3 1613771
700 1 $a Marinescu, Ioan D. $4 edt $3 1613772
700 1 $a Kurokawa, Syuhei. $4 edt $3 1613773
856 4 0 $3 ScienceDirect $u http://www.sciencedirect.com/science/book/9781437778595
938 $a Books 24x7 $b B247 $n bke00044782